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ForTii? LDS85

Manufacturer: Envalior/DSM
Produced At: Europe / China
Product Category: Polyamide 4T（PA4T）
Product No: ForTii LDS85
Product Quantity: 25KG / BAG
Product Features: Additive Mold Release

Product information

ForTii? LDS85

Polyamide 4T

Product Description:

30% Glass Reinforced, Laser Direct Structuring (LDS)

Special Features:

Contains release agent

Laser Direct Structuring

Used In:

Smartphone frames

ForTii? is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii? in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €" and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.

Filler / Reinforcement	Glass Fiber, 30% Filler by Weight
Additive	Mold Release
Uses	Cell Phones
Processing Method	Injection Molding
Resin ID (ISO 1043)	PA4T-GF30

Physical	Dry	Conditioned	Unit	Test Method
Density	1.47	--	g/cm3	ISO 1183
Molding Shrinkage				ISO 294-4
Across Flow	1.3	--	%
Flow	0.50	--	%
Water Absorption (Equilibrium, 73°F, 50% RH)	1.6	--	%	ISO 62

Mechanical	Dry	Conditioned	Unit	Test Method
Tensile Modulus	1.52E+6	1.52E+6	psi	ISO 527-2
Tensile Stress (Break)	21800	21800	psi	ISO 527-2
Tensile Strain (Break)	2.0	2.0	%	ISO 527-2
Impact	Dry	Conditioned	Unit	Test Method
Charpy Notched Impact Strength(73°F)	1.9	--	ft·lb/in2	ISO 179/1eA
Charpy Unnotched Impact Strength(73°F)	14	--	ft·lb/in2	ISO 179/1eU

Thermal	Dry	Conditioned	Unit	Test Method
Heat Deflection Temperature
66 psi, Unannealed	581	--	°F	ISO 75-2/B
264 psi, Unannealed	545	--	°F	ISO 75-2/A
Glass Transition Temperature 2	257	--	°F	ISO 11357-2
Melting Temperature 2	617	--	°F	ISO 11357-3
CLTE				ASTM D696
Flow	1.4E-5	--	in/in/°F
Transverse	2.5E-5	--	in/in/°F

Electrical	Dry	Conditioned	Unit	Test Method
Volume Resistivity	> 1.0E+15	> 1.0E+15	ohms·cm	IEC 60093
Relative Permittivity (1.00 GHz)	3.70	--		IEC 60250
Comparative Tracking Index	550	--	V	IEC 60112
Flammability	Dry	Conditioned	Unit	Test Method
Flammability Classification (0.03 in)	HB	--		IEC 60695-11-10, -20

Injection	Dry	Unit
Drying Temperature	212	°F
Drying Time	2.0	hr
Rear Temperature	608 to 626	°F
Middle Temperature	617 to 635	°F
Front Temperature	626 to 635	°F
Nozzle Temperature	626 to 635	°F
Processing (Melt) Temp	626 to 644	°F
Mold Temperature	212 to 302	°F
Injection Rate	Moderate-Fast
Back Pressure	72.5 to 435	psi
Screw Compression Ratio	2.5:1.0

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ForTii? LDS85

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